Published: 25 Apr 2025 112 views
In partnership with The Malaysian Australian Alumni Council, Bond University offers high academic achievers from Malaysia, who are applying to study at an undergraduate level for a bachelor's degree, with part-fee tuition remission scholarships.
Bond University - MACC* Undergraduate Excellence Scholarships are awarded on the basis of academic excellence and are a testament to Bond University’s commitment to quality and outstanding international students.
The Bond University is a private not-for-profit university located in Robina, Gold Coast, Queensland, Australia. The University was established at the initiative of Alan Bond, the founder and Chairman of Bond Corporation and Harunori Takahashi, President of EIE International. The University's development was funded via a joint venture between Bond Corporation in Australia and the Japanese entity, EIE International. In 1987, the Parliament of Queensland granted Bond University university status via the passage of the Bond University Act. The University commenced teaching in May 1989 with... continue reading
Application Deadline | Not Specified |
Country to study | Australia |
School to study | Bond University |
Type | Undergraduate |
Sponsor | Bond University |
Gender | Men and Women |
As a MACC Undergraduate Excellence Scholar, you will be awarded up to 50% tuition remission for any single undergraduate bachelor’s degree (excluding the Bond Medical Program) and will commence your study in either the May or September semester.
To be eligible to apply for this scholarship, you must:
Applications for this scholarship are made directly with the Malaysian Australian Alumni Council.
Applicants must complete the Bond University MACC Scholarship Application Form (Word document). Once complete, you must submit it along with supporting documents to MAAC for consideration.
You must complete and submit your scholarship application before the application closing date as no late scholarship applications will be considered.
For more details, visit Bond University scholarship webpage